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COMP
04 · POWER
onsemi
ON·NASDAQ

CHOKEPOINT LENS

LAYER04 · Power
CHOKECOMPETITIVE
CHINACHINA-INSULATED · STEEL bezel
ACCESSIBLEYes · US/EU-listed, normal retail access
NODESiC/GaN power electronics

DOSSIER

ROLE

US power-semiconductor maker — SiC substrates through modules, a CHIPS Act SiC-funding beneficiary.

CHOKE POSITION

Part of the Western SiC/GaN foothold (with Infineon, Wolfspeed, STMicro) in an otherwise China-controlled layer.

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Key readouts, what makes the choke pay, what breaks it, and the catalysts on the watch — for every instrument on the board.


PERFORMANCE

No market data available for this instrument.


RELATED SIGNALS

FULL FEED →
2025-06-15Policy

US CHIPS Act funding for SiC power electronics — Wolfspeed, onsemi beneficiaries

DOE announces $2.1B in CHIPS Act incentives for SiC substrate and power-device manufacturing. Wolfspeed and onsemi to receive direct funding for 200mm SiC fabs in North Carolina.


INTELLIGENCE FILES


ADJACENT INSTRUMENTS


NOTES

Western foothold in power layer


Market intelligence, not financial advice.